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Phys. Rev. B 77, 205207 (2008) [6 pages]

Electronic structure, bonding character, and thermoelectric properties of semiconducting rhenium silicide with doping

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Anning Qiu, Lanting Zhang*, Aidang Shan, and Jiansheng Wu
School of Materials Science and Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Shanghai 200240, People’s Republic of China

Received 20 January 2008; revised 21 April 2008; published 22 May 2008

The electronic structure and thermoelectric properties of ReSi1.75 and its doped systems are studied by the first-principles calculation using the full-potential linearized augmented plane-wave method in the local density approximation with self-interaction correction and the semiclassical Boltzmann theory. ReSi1.75 shows narrow gap semiconductor behavior with an indirect gap of 0.12 eV and a direct gap of 0.36 eV. The Fermi levels of Al- and Mo-doped systems move into the valence band. The Al-doped compound remains a semiconductor while the gap of Mo-doped compounds becomes small and nearly disappears. The relations between the electronic structure and thermoelectric properties of doped ReSi1.75 are analyzed and explained in detail. Our calculations strongly suggest that an excellent thermoelectric performance can be obtained for p-doped ReSi1.75 along [100] and for n-doped ReSi1.75 along [001] compared with the undoped compound.

© 2008 The American Physical Society

URL:
http://link.aps.org/doi/10.1103/PhysRevB.77.205207
DOI:
10.1103/PhysRevB.77.205207
PACS:
71.15.Ap, 72.15.Jf, 84.60.Rb

*Author to whom correspondence should be addressed; lantingzh@sjtu.edu.cn