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Phys. Rev. B 76, 195419 (2007) [10 pages]

Luminescence-center-mediated excitation as the dominant Er sensitization mechanism in Er-doped silicon-rich SiO2 films

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Oleksandr Savchyn*, Forrest R. Ruhge, and Pieter G. Kik
CREOL, The College of Optics and Photonics, University of Central Florida, 4000 Central Florida Boulevard, Orlando, Florida 32816, USA

Ravi M. Todi‡,§, Kevin R. Coffey**,‡,†, Haritha Nukala, and Helge Heinrich
Advanced Materials Processing and Analysis Center (AMPAC), University of Central Florida, 4000 Central Florida Boulevard, Orlando, Florida 32816, USA

Received 8 August 2007; published 15 November 2007

The structural and optical properties of erbium-doped silicon-rich silica samples containing 12 at. % of excess silicon and 0.63 at. % of erbium are studied as a function of annealing temperature in the range 600–1200 °C. Indirect excitation of Er3+ ions is shown to be present for all annealing temperatures, including annealing temperatures well below 1000 °C for which no silicon nanocrystals are observed. Two distinct efficient (ηtr>60%) transfer mechanisms responsible for Er3+ excitation are identified: a fast transfer process (τtr<80 ns) involving isolated luminescence centers (LCs), and a slow transfer process (τtr∼4–100 μs) involving excitation by quantum confined excitons inside Si nanocrystals. The LC-mediated excitation is shown to be the dominant excitation mechanism for all annealing temperatures. The presence of a LC-mediated excitation process is deduced from the observation of an annealing-temperature-independent Er3+ excitation rate, a strong similarity between the LC and Er3+ excitation spectra, as well as an excellent correspondence between the observed LC-related emission intensity and the derived Er3+ excitation density for annealing temperatures in the range of 600–1000 °C. The proposed interpretation provides an alternative explanation for several observations existing in the literature.

© 2007 The American Physical Society

URL:
http://link.aps.org/doi/10.1103/PhysRevB.76.195419
DOI:
10.1103/PhysRevB.76.195419
PACS:
78.67.Bf, 71.35.Gg, 71.55.−i, 76.30.Kg

*Corresponding author; osavchyn@mail.ucf.edu

Also at Physics Department, University of Central Florida, 4000 Central Florida Blvd., Orlando, FL 32816.

Also at School of Electrical Engineering and Computer Science, University of Central Florida, 4000 Central Florida Blvd., Orlando, FL 32816.

§Present address: Semiconductor Research and Development Center, IBM Microelectronics, 2070 Route 52, Hopewell Junction, NY 12533.

**Also at Department of Mechanical, Materials and Aerospace Engineering, University of Central Florida, 4000 Central Florida Blvd., Orlando, FL 32816.