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Phys. Rev. B 68, 161302(R) (2003) [4 pages]

Atomic layer deposition of Al2O3 on H-passivated Si: Al(CH3)2OH surface reactions with H/Si(100)-2×1

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Mathew D. Halls1, Krishnan Raghavachari1,*, Martin M. Frank2, and Yves J. Chabal2
1Department of Chemistry, Indiana University, Bloomington, Indiana 47405, USA
2Department of Chemistry and Chemical Biology, Rutgers University, Piscataway, New Jersey 08554, USA

Received 30 March 2003; revised 23 June 2003; published 8 October 2003

Infrared absorption studies of Al(CH3)3 interacting with H-terminated Si reveal that O incorporation from gas-phase impurities may be a crucial factor in interface formation in atomic layer deposition. Hybrid density-functional calculations have therefore been carried out on silicon cluster models to investigate the possible pathways for reaction between the important atomic layer deposition side-reaction product Al(CH3)2OH (DMAOH) and the H/Si(100)-2×1 surface. Comparisons with the analogous surface reactions for Al(CH3)3 and H2O are made. In general, the DMAOH surface reaction pathways are characterized by an activation of reactions involving the OH groups and suppression of CH3 group reactions, compared to Al(CH3)3 and H2O. A unique reaction pathway for DMAOH and the H/Si(100)-2×1 surface is identified resulting in the deposition of -O-Al(CH3)2 on the surface, which is significant since it represents an atomic-layer interface between Si and Al2O3. This reaction has an energy barrier of 1.3 eV and is the most thermodynamically favored pathway with an exothermicity of 0.9 eV.

© 2003 The American Physical Society

URL:
http://link.aps.org/doi/10.1103/PhysRevB.68.161302
DOI:
10.1103/PhysRevB.68.161302
PACS:
68.43.Bc, 77.84.Bw, 81.10.Bk, 31.15.Ar

*Corresponding author. Electronic mail: kraghava@indiana.edu