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Phys. Rev. B 67, 075316 (2003) [14 pages]

Theory of strain relaxation in heteroepitaxial systems

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A. C. Schindler1, M. F. Gyure1,2, G. D. Simms2, D. D. Vvedensky1, R. E. Caflisch3,4, C. Connell3, and Erding Luo3
1The Blackett Laboratory, Imperial College, London SW7 2BZ, United Kingdom
2HRL Laboratories LLC, 3011 Malibu Canyon Road, Malibu, California 90265
3Department of Mathematics, University of California, Los Angeles, California 90095-1555
4California NanoSystems Institute and Department of Materials Science & Engineering, University of California, Los Angeles, California 90095

Received 29 August 2001; revised 20 December 2002; published 28 February 2003

We introduce a general approach to calculating the morphological consequences of coherent strain relaxation in heteroepitaxial thin films based on lattice statics using linear elasticity. The substrate and film are described by a simple cubic lattice of atoms with localized interactions. The boundary conditions at concave and convex corners that appear as a result of this construction, those along straight interfacial segments, and the governing equations are obtained from a variational calculation applied to a discretized form of the total elastic energy. The continuum limit of the equations and the boundary conditions along straight boundaries reproduces standard results of elasticity theory, but the boundary conditions at corners have no such analog. Our method enables us to calculate quantities such as the local strain energy density for any surface morphology once the lattice misfit and the elastic constants of the constituent materials are specified. The methodology is illustrated by examining the strain, displacement, and energies of one-dimensional strained vicinal surfaces. We discuss the effects of epilayer thickness on the energy of various step configurations and suggest that coupling between surface and substrate steps should affect the equilibration of the surface toward the bunched state.

© 2003 The American Physical Society

URL:
http://link.aps.org/doi/10.1103/PhysRevB.67.075316
DOI:
10.1103/PhysRevB.67.075316
PACS:
68.55.-a, 68.35.Gy, 68.60.-p