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Phys. Rev. B 64, 233203 (2001) [3 pages]

Silicon self-diffusion constants by tight-binding molecular dynamics

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Anna Jääskeläinen,1, Luciano Colombo,2*, and Risto Nieminen1
1Laboratory of Physics, Helsinki University of Technology, P.O. Box 1100, FIN–02015 HUT, Finland
2Istituto Nazionale per la Fisica della Materia and Department of Physics, University of Cagliari, Cittadella Universitaria, I–09042 Monserrato (CA), Italy

Received 16 May 2001; revised 19 July 2001; published 29 November 2001

The thermodynamic integration method has been incorporated into the tight-binding molecular-dynamics scheme to compute formation free energies of native point defects in bulk silicon. By combining previous simulated diffusivity data with present free-energy estimates, we present a thorough quantum-mechanical picture of self-diffusion in silicon that is both consistent with the state-of-the-art experimental data and able to predict separately the vacancy and self-interstitial contributions.

© 2001 The American Physical Society

URL:
http://link.aps.org/doi/10.1103/PhysRevB.64.233203
DOI:
10.1103/PhysRevB.64.233203
PACS:
66.30.Hs, 61.72.Ji, 61.72.Bb

*Corresponding author. Email address: luciano.colombo@dsf.unica.it