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Phys. Rev. B 58, 12559–12562 (1998)

Thermal evolution of defects in H-implanted Si studied by monoenergetic positrons

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M. Fujinami*
Advanced Technology Research Laboratories, Nippon Steel Corporation, 3-35-1 Ida, Nakahara, Kawasaki 211-0035, Japan

R. Suzuki, T. Ohdaira, and T. Mikado
Electrotechnical Laboratory, 1-1-4 Umezono, Tsukuba 305, Japan

Received 14 May 1998; published in the issue dated 15 November 1998

The behavior of hydrogen-vacancy defects in silicon implanted with H ions (1×1016/cm2, 60 keV) has been investigated by means of a slow positron beam, in which both the positron lifetime and the Doppler broadening have been measured. It has been found that the positron-trapping defect associated with H is formed within the H implantation profile. This gives rise to a long positron lifetime, which is close to that characteristic of a monovacancy. However, the Doppler broadening parameter S of this defect is not as large as that of the monovacancy, since positrons annihilate electrons of H within the defect. Upon annealing at up to 400 °C, the defects located within 350 nm of the surface are agglomerated and also hydrogenated, whereas the H-decorated defects within the H implantation profile are unchanged. Hydrogenation stabilizes and immobilizes the defects in this temperature range. Annealing at 500 °C leads to the agglomeration of the H-decorated defects in the vicinity of the peak of the hydrogen implantation profile. Annealing at 600 °C leads to hydrogen release from these agglomerates. It has been found that a high density of hydrogen-stabilized defects is present within the implantation profile upon annealing at 400 °C. This high density allows for the formation of larger vacancy clusters upon higher temperature annealing.

© 1998 The American Physical Society

URL:
http://link.aps.org/doi/10.1103/PhysRevB.58.12559
DOI:
10.1103/PhysRevB.58.12559
PACS:
61.72.-y

*Present address: Integrated Chemistry Project, Kanagawa Academy of Science and Technology, KSP-East 307, 3-2-1 Sakado, Takatsu, Kawasaki 213-0012, Japan.