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Phys. Rev. B 51, 16164–16167 (1995)

High-angle grain-boundary junctions in YBa2Cu3O7: Normal-state resistance and 1/f noise

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Li Liu, E. R. Nowak, and H. M. Jaeger
James Franck Institute and Department of Physics, The University of Chicago, Chicago, Illinois 60637

B. V. Vuchic and K. L. Merkle
Materials Science Division, Argonne National Laboratory, Argonne, Ilinois 60439

D. B. Buchholz and R. P. H. Chang
Department of Material Science and Engineering, Northwestern University, Evanston, Illinois 60208

Received 11 August 1994; published in the issue dated 1 June 1995

We have investigated the normal-state resistance and the excess low-frequency (1/f) noise in 45° tilt [001] grain-boundary junctions in YBa2Cu3O7 thin films. A characteristic temperature dependence of the resistance fluctuations and a linear temperature dependence of the grain-boundary resistance (with a negative temperature coefficient) emerge as common features. These observations are quantitatively compared with a model of many, parallel conduction paths across the boundary, taking into account both temperature-independent and thermally activated transport processes.

© 1995 The American Physical Society

URL:
http://link.aps.org/doi/10.1103/PhysRevB.51.16164
DOI:
10.1103/PhysRevB.51.16164
PACS:
74.25.Fy, 74.40.+k, 74.50.+r, 68.55.Ln